Harris® SCPF1 Stay Clean® General Purpose Solder Flux, 1 lb, Jar Container

Stay Clean® paste soldering flux was designed primarily for copper-to-copper and copper-to-brass connection. In its paste form it is ideal for soldering tube joints. It is not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. This flux works well with most leaded and lead-free solder compositions. The flux residue should be removed after soldering.

Harris® Solder Flux, General Purpose, Series: Stay Clean®, 1 lb, Jar, Paste, Composition: 2 to 15 % Ethylene Glycol , 1 to 10 % Ammonium Chloride, 5 to 30 % Zinc Chloride, 30 to 80 % Petrolatum and 1 to 10 % Water, Odorless, Up to 600 deg F, 1.11 Specific Gravity, Applicable Materials: Brass, Bronze, Copper, Copper to Copper, Copper to Brass, Galvanized Steel and Steel